new in TRIFLEX®Windows 2.3.1?
2.3.1 has added numerous new Enhancements &
Modifications to the 2.2.1 release. Some of the major Enhancements
ASME Refrigeration Piping and Heat Transfer Components Code
– In this release of TRIFLEXâWindows adds the
ASME Refrigeration Piping Code, B31.5, to our comprehensive
list of design piping codes from which the user may choose.
Relief Valves – An additional component type,
a Pressure Relief Valve, is added to the component toolbar
and may be included directly in a piping system without
interpretative modeling. An associated database of representative
valves is also included.
Vessel Representation – When the piping system
originates or terminates at a vessel, TRIFLEXâWindows
now provides a graphical representation of the vessel instead
of a rectangular block specifying an anchor. A tab on the
anchor dialog brings up a user interface, allowing the specification
of vessel properties, including size, orientation, and attachment
Disk – The flange dialog now allows for the
specification of a Rupture Disk for which a flange pair
will model the holder.
Material Database – The TRIFLEX®Windows
material database now includes selections for all material
included in the ASME piping code. Choosing a material in
the database, when using the B31.1 code, automatically enters
material modulus of elasticity, thermal expansion coefficient,
density, and allowable stress at the appropriate process
File Export – Three-dimensional DXF files
compatible with a variety of drawing programs, including
AutoCAD, may now be produced from within the program. The
drawing produced is a line model, typical of piping isometrics,
with dimensional data included.
Import – The program now allows the direct
import of PCF files as produced by Alias Ltd’s I-Sketch
isometric drawing program. Piping systems entered using
Alias’s tools including field data entered on PDA
using I-Sketch Field, may be directly imported and analyzed
and many more. Please read the 2.3.1
Enhancements & Modifications and also the E&M
for versions 2.2.1